Grants.gov · NIST · Cooperative Agreement
CHIPS Incentives Program, Facilities for Semiconductor Materials and Manufacturing Equipment
National Institute of Standards and Technology
- Status
- Open
- Maximum funding
- Varies
- Deadline
- Nov 01, 2026
- Instrument
- Cooperative Agreement
About this funding opportunity
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Topic areas: General and Cross-cutting R&D, Advanced Manufacturing and Industry, Security and Defense.
Funding amount
This cooperative agreement provides Varies in funding.
Deadline
Applications are due Nov 01, 2026. Confirm the exact closing time on the official program page before applying.
Who can apply
This opportunity is open to the following applicant types:
- Other
- Research Organization
- SME
- Startups
- University
- Large Company
- NGOs
- Public Authorities
Eligibility
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Agency
CHIPS Incentives Program, Facilities for Semiconductor Materials and Manufacturing Equipment is administered by National Institute of Standards and Technology (NIST), listed via Grants.gov.
Open the official opportunity page Browse all US R&D funding on GrantField
Programme data is aggregated by GrantField from public sources and may change. Always verify details on the official page before applying.